Outstanding thermal performance thanks to the softest and highest thermally conductive gap fillers available.
Thermally conductive gap fillers give engineers and designers the most dimensionally toleranced materials available. Their extreme compliancy reduces component stress while the higher thermal conductivity provides the outstanding thermal performance that the next generation of designs will demand.
Our thermally conductive gap fillers are the softest and highest thermally conductive gap fillers available, and come in a range of thicknesses from 0.20 mm to 5.08 mm. They are designed for a variety of applications including notebook computers, handheld microprocessor devices, telecoms hardware, semi-conductor test equipment, servers and desktop computers, memory modules, mass storage devices, power conversion equipment, flat panel displays, and audio and video components.