A wide range offering the maximum thermal performance of any phase change materials available on the market.
At room temperature, thermal phase change materials are solid pads, which then melt at operating temperatures to make a close contact on the mating surfaces to produce low thermal resistance.
We can provide a wide range of phase change materials for a variety of applications including microprocessors, chipsets, graphics processing units, custom ASICS, power components and modules, and memory modules.
Our thermal phase change materials are specifically designed to give you stable and reliable performance. They provide superior surface wetting, minimum bond-lines thickness and actively expel trapped air. This all helps contribute to the maximum thermal performance of any phase change material available on the market. Our products are supplied on rolls with top tabbed liners for easy application – a better method than thermal grease application.