The T-gon™ 800 Series shapes itself exactly to surfaces, maximizing the transfer of heat and minimizing thermal resistance.

conductive-interface-pad

The T-gon™ 800 Series is a high performance, cost-effective thermal interface material which can be used where electrical isolation is not needed. Its unique grain-oriented, plate-like structure allows it to shape itself exactly to surfaces, therefore maximizing the transfer of heat. It is particularly suitable for use in power conversion equipment and power supplies, large telecoms switching hardware and notebook computers.

T-gon™ 800 can be supplied in 12" x 18" (305 mm x 457 mm) or 18" x 24" (457 mm x 914 mm) sheets, in rolls or die cut to the specific configurations you require, and is available with proprietary pressure sensitive adhesive on one side. This adhesive coating is the thinnest available, therefore minimizing any impact on thermal performance.

It has low thermal resistance, high thermal conductivity of 5 W/mK in Z axis and 140 W/mK in the X-Y axis, has more than 98% graphite and comes in thicknesses of 0.005, 0.010 and 0.020 inches (0.125 mm, 0.25 mm and 0.50 mm). 

Want to know more? Call DK-Evolution on (831) 480-2322 today.